What is Sputtering?
A type of PVD in which ions in a plasma bombard a target and the ejected atoms are deposited on the wafer.
Field: Deposition (CVD and PVD)
Sputtering in the explanations
Sputtering accelerates ions from an argon or similar plasma at several hundred volts into a target; atoms knocked out by momentum transfer deposit on the wafer.
Into which category does deposition by sputtering fall?In conventional sputtering atoms arrive from many angles and seldom reach the bottoms of deep holes.
What is the main purpose of a sputtering method that ionize…Sputtering ejects atoms physically from the target surface, so once the surface composition stabilizes, films closely match the target.
Which is an advantage of sputtering over vacuum evaporation?
Questions that mention Sputtering (17)
- Into which category does deposition by sputtering fall?
- What is the main purpose of a sputtering method that ionizes sputtered atoms and draws them vertically onto the wafer with a bias?
- What is generally done to increase the deposition rate in sputtering?
- What does "sputter yield" mean in sputtering?
- What is the purpose of placing a plate with many holes (a collimator) between the target and wafer in a sputtering system?
- In PVD such as sputtering and evaporation, why is it hard to coat the sidewalls and bottoms of deep trenches?
- Which is an advantage of sputtering over vacuum evaporation?
- Which correctly describes the target used in sputtering?
- What purity is typically required for copper sputtering targets used for seed layers?
- In dense assemblies such as smartphones, what is the purpose of forming a metal film on the package surface by sputtering or similar?
- Which correctly describes step coverage in deposition?
- Which correctly describes vacuum evaporation?
- What is the main reason many deposition processes are carried out in vacuum equipment?
- Which deposition method has mainly been used to form aluminum wiring films?
- Which model organizes, by temperature and gas pressure, the tendency of sputtered metal films to form columnar grains with many voids at low deposition temperatures?
Related terms
Plasma CVD Step coverage Precursor ALD Vacuum evaporation Thermal oxidation Yield Shadowing Electromigration