Deposition (CVD and PVD)

Which correctly describes step coverage in deposition?

  1. AHow thick the film deposited on the sidewalls and bottom of a step is compared with flat areas
  2. BThe electrical resistance of the film
  3. CThe deposition rate per minute
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Answer: A. How thick the film deposited on the sidewalls and bottom of a step is compared with flat areas

Step coverage indicates how much film is deposited on the sidewalls and bottoms of features such as trenches and holes compared with flat areas. In general, PVD such as sputtering has poor step coverage, while CVD, and ALD even more so, can deposit uniformly deep inside features.

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More Deposition (CVD and PVD) questions

  1. Which deposition method is mainly used to fill trenches for copper wiring?
  2. Which is a characteristic of low-pressure CVD (LPCVD)?
  3. Which source gas is commonly used to deposit polysilicon by LPCVD?
  4. Which correctly describes vacuum evaporation?
  5. What problem tends to occur when a deposited thin film has large internal stress?