What is Electroplating?
Depositing metal by passing current through a plating bath with the wafer as the cathode. It fills copper interconnect trenches, with additives making the fill proceed from the bottom up.
Field: Deposition (CVD and PVD)
Electroplating in the explanations
Electroplating deposits copper by passing current through the wafer surface to reduce copper ions, so a continuous conductive layer must line the trenches.
What is the role of the thin copper film sputtered before f…
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Related terms
ALD Area-selective deposition CVD Electrostatic chuck HDP-CVD (high-density plasma CVD) LPCVD (low-pressure CVD) Magnetron sputtering PECVD (plasma-enhanced CVD) Reactive sputtering Spin coating