Deposition (CVD and PVD)

Which is an advantage of sputtering over vacuum evaporation?

  1. AThe energy of the depositing atoms is low
  2. BThe deposition rate is always higher
  3. CFilms can be deposited while largely preserving the composition of alloy or compound targets, with good adhesion
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Answer: C. Films can be deposited while largely preserving the composition of alloy or compound targets, with good adhesion

In evaporation, each component of an alloy evaporates with different ease, so the film composition tends to shift. Sputtering physically ejects atoms from the target surface, so composition is largely preserved. The arriving atoms also have higher energy, giving better film adhesion.

  • A. Sputtered atoms have higher energy than evaporated ones, which improves adhesion.
  • B. Depending on material and conditions, evaporation can be faster.
  • C. Correct. Preserving composition and good adhesion are its advantages.
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More Deposition (CVD and PVD) questions

  1. Which type of CVD reactor heats only the stage holding the wafer while keeping the reactor walls cool?
  2. Which is an example of the precursors used to deposit HfO2 gate dielectrics by ALD?
  3. Which model organizes, by temperature and gas pressure, the tendency of sputtered metal films to form columnar grains with many voids at low deposition temperatures?
  4. In CVD, what is the phenomenon called in which more source gas is consumed and the deposition rate drops as the area of wafers or patterns being coated increases?
  5. In reactive sputtering, what is the phenomenon called in which, with too much reactive gas flow, the target surface becomes covered with a compound and the deposition rate drops sharply?