Deposition (CVD and PVD)

Into which category does deposition by sputtering fall?

  1. APVD (physical vapor deposition)
  2. BCVD (chemical vapor deposition)
  3. CThermal oxidation
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Answer: A. PVD (physical vapor deposition)

Sputtering bombards a target with ions from a plasma and deposits the ejected atoms on the wafer; because it relies on a physical phenomenon, it is classified as PVD. It is used to deposit metal wiring, barrier metals and more.

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More Deposition (CVD and PVD) questions

  1. Which is a characteristic of ALD (atomic layer deposition)?
  2. What is the main advantage of plasma CVD (PECVD)?
  3. Which correctly describes step coverage in deposition?
  4. Which deposition method is mainly used to fill trenches for copper wiring?
  5. Which is a characteristic of low-pressure CVD (LPCVD)?