Process materials (gases and chemicals)

Which correctly describes the target used in sputtering?

  1. AA plate made of the material to be deposited, from which atoms are ejected by ion bombardment
  2. BAn electrostatic chuck for holding the wafer
  3. CA photomask used for exposure
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Answer: A. A plate made of the material to be deposited, from which atoms are ejected by ion bombardment

A target is a plate made of the material to be deposited, such as Ti, Ta, Cu or Al. When ions from the plasma strike it, surface atoms are ejected and deposit on the wafer as a film. Because it directly affects film quality, the target must also have high purity and a uniform microstructure.

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