What is Seed layer?
A thin copper film deposited by sputtering or similar before copper electroplating. It provides the conductive path for the plating current.
Field: Interconnect processes
Seed layer in the explanations
In the damascene process, a barrier (e.g., Ta/TaN) and a Cu seed layer a few to tens of nm thick are sputtered into the trenches, and copper is then electroplated to fill them.
Which deposition method is mainly used to fill trenches for…A TSV is made by etching a hole in silicon by deep etching (such as the Bosch process), forming an insulating film, barrier layer and seed layer on the inside of the hole, then filling it with copper or similar by plating.
Which correctly describes the typical TSV formation process?
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Related terms
Damascene process TSV (through-silicon via) Bosch process (deep RIE) Air gap Backside power delivery Barrier metal Black's equation Crosstalk Dual damascene Interconnect via