Deposition (CVD and PVD)

What is generally done to increase the deposition rate in sputtering?

  1. AIncrease the power applied to the target
  2. BMake the gas pressure extremely high
  3. CReduce the power to the target to zero
Show answer and explanation

Answer: A. Increase the power applied to the target

Increasing the power applied to the target increases the number and energy of ions striking it, ejecting more atoms and raising the deposition rate. However, attention must be paid to target heating and cracking and to effects on film quality.

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More Deposition (CVD and PVD) questions

  1. For films of the same material, in what way are high-temperature thermal CVD films generally better than plasma CVD films?
  2. What is the approximate film thickness deposited in one ALD cycle?
  3. What is an advantage of vacuum evaporation that heats material with an electron beam?
  4. Which technique uses differences in surface materials to grow films only in specific places?
  5. What is the most appropriate range for the thickness of thin films handled in semiconductor manufacturing?