What is Slurry?
The liquid used in CMP, with fine abrasive particles dispersed in chemicals. It flattens surfaces by combining chemical action with mechanical polishing.
Field: CMP and cleaning
Slurry in the explanations
Slurry disperses abrasive particles tens to over a hundred nm in size—silica (SiO2), ceria (CeO2), alumina—in chemistry containing oxidizers, pH adjusters, corrosion inhibitors and dispersants.
Which correctly describes the slurry used in CMP?Slurry particles can agglomerate into large clusters through temperature swings in storage, shear in piping or drying, and these clusters scratch wafers.
What is the main purpose of installing filters in the lines…It also reduces slurry use and waste and has been used for STI planarization, though controlling pad-induced defects is a challenge.
Which CMP method fixes the abrasive particles in the polish…
Questions that mention Slurry (17)
- In the mirror polishing (final CMP polishing) of silicon wafers, what is commonly used as the abrasive in the slurry?
- Which correctly describes the slurry used in CMP?
- Why are oxidizers such as hydrogen peroxide added to the slurry in tungsten CMP?
- What is the main purpose of installing filters in the lines that supply CMP slurry to the polisher?
- Which CMP method fixes the abrasive particles in the polishing pad instead of putting them in the slurry?
- Which equipment is commonly used to slice a silicon ingot into many wafers at once?
- Which correctly describes CMP (chemical mechanical polishing)?
- What in particular must be removed by cleaning after CMP?
- In Preston's equation for CMP removal rate, which quantity is the removal rate proportional to?
- What is the main cause of fine scratches on the wafer surface in CMP?
- Which combination correctly lists processes in which CMP is used?
- What is the operation called in which the surface of a CMP pad is dressed with a diamond tool to stabilize the removal rate?
- Which correctly describes the basic configuration of a CMP tool?
- In Cu interconnect CMP, why is polishing generally divided into stages?
- As CMP continues, the polishing pad temperature rises. How does the removal rate generally change?
Related terms
CMP Ceria (cerium oxide) STI (shallow trench isolation) Ingot Dicing Preston's equation Pad conditioning Gate-last (replacement metal gate) Barrier metal Dilute hydrofluoric acid (DHF)