CMP and cleaning

Which combination correctly lists processes in which CMP is used?

  1. APlanarization of STI oxide, tungsten plugs, copper damascene wiring and more
  2. BExposure and resist coating
  3. CIon implantation and annealing
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Answer: A. Planarization of STI oxide, tungsten plugs, copper damascene wiring and more

CMP is used in many steps, including planarizing STI fill oxide and interlayer dielectrics and removing excess metal for tungsten plugs and copper wiring. Slurries, pads and polishing conditions are chosen for each material.

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More CMP and cleaning questions

  1. What is the operation called in which the surface of a CMP pad is dressed with a diamond tool to stabilize the removal rate?
  2. Compared with planarization by thermal reflow or etch-back, what is an advantage of CMP?
  3. Which correctly describes the order and purposes of SC-1 and SC-2 in standard RCA cleaning?
  4. What is the main cause of pattern collapse when cleaning and drying high-aspect-ratio patterns?
  5. Why are oxidizers such as hydrogen peroxide added to the slurry in tungsten CMP?