What is Dicing?
Cutting a wafer into individual chips (dies). Besides sawing with a rotating blade, there are methods such as stealth dicing, which forms a modified layer inside the wafer with a laser.
Field: Packaging and assembly
Dicing in the explanations
Dicing is the step in which a wafer with finished circuits is cut with a diamond blade or laser and separated into individual chips (dies).
Which correctly describes dicing?Stealth dicing focuses a laser at a wavelength that passes through silicon inside the wafer to create a modified layer, and the wafer is broken from there by stretching the tape.
Which dicing method, with almost no kerf loss, focuses a la…Dicing blades, by contrast, cut finished wafers into chips.
Which equipment is commonly used to slice a silicon ingot i…
Questions that mention Dicing (5)
- Which correctly describes dicing?
- What is the step called that grinds the back side of a wafer before dicing to thin it and make the package thinner?
- Which dicing method, with almost no kerf loss, focuses a laser inside the wafer to create a modified layer and then separates chips by stretching the tape?
- Which equipment is commonly used to slice a silicon ingot into many wafers at once?
- Which correctly describes a feature of wafer-level packaging (WLP)?
Related terms
Die bonding Wire bonding MEMS Ingot Slurry WLP (wafer-level package) Backgrinding BGA CSP (chip-scale package) Flip chip