What is Barrier metal?
A thin metal film around copper wiring that prevents copper from diffusing into insulating films or silicon, such as Ta or TaN.
Field: Interconnect processes
Barrier metal in the explanations
Copper CMP sequentially removes the thick overburden copper (hundreds of nm to about 1 µm), the few-nm barrier metal (e.g., Ta/TaN) and a little of the dielectric beneath.
In Cu interconnect CMP, why is polishing generally divided …Copper lines are therefore lined on sides and bottom with a few nm of barrier metal such as Ta/TaN and capped on top with a dielectric film.
What is the main purpose of barrier metals such as Ta and T…As vias shrink, their cross-sectional area falls and resistance rises, while the resistive barrier metal needed to block copper diffusion (2–3 nm thick) cannot thin much, occupying a large share of a 20 nm via.
In scaled multilevel wiring, what is the main reason via re…
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Related terms
CMP Slurry ALD Air gap Backside power delivery Black's equation Crosstalk Damascene process Dual damascene Interconnect via