CMP and cleaning

Which CMP method fixes the abrasive particles in the polishing pad instead of putting them in the slurry?

  1. ASpin coating
  2. BFixed-abrasive CMP
  3. CElectroplating
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Answer: B. Fixed-abrasive CMP

Fixed-abrasive CMP uses a pad with abrasive particles embedded in resin and supplies only chemicals. Because mainly the high points contact the abrasive and get removed, it planarizes well, and it reduces slurry consumption and waste, so it has been used for STI planarization and similar.

  • A. Spin coating spreads liquid by rotation to form a film.
  • B. Correct. The abrasive particles are fixed in the pad.
  • C. Electroplating deposits metal electrically.
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More CMP and cleaning questions

  1. Which known problem tends to occur if rinsing after SPM (sulfuric acid and hydrogen peroxide) cleaning is insufficient?
  2. Which polishing method, studied for uses that require low mechanical force, combines electrochemical dissolution to planarize metal?
  3. Which correctly describes CMP (chemical mechanical polishing)?
  4. What is the main purpose of SC-1 (a mixture of ammonia and hydrogen peroxide) in RCA cleaning?
  5. Which correctly describes 'dishing' in CMP?