What is Ingot?
A cylindrical single-crystal block grown by the CZ method or similar, before it is cut into wafers. The ends are removed and the outside is ground to a uniform diameter before slicing.
Field: Silicon wafers
Ingot in the explanations
The ingot is ground to a uniform diameter and notched, then sliced to just under 1 mm thick with a multi-wire saw.
What is the most appropriate order of steps for making wafe…A multi-wire saw strings hundreds of parallel wires about 0.1 mm in diameter, running at high speed with abrasive slurry or fixed diamond, slicing an ingot into hundreds of wafers at once.
Which equipment is commonly used to slice a silicon ingot i…Boron's segregation coefficient of about 0.8, close to 1, keeps its concentration relatively uniform from top to bottom of the ingot, making it easy to work with.
Which impurity is typically added to the melt to make p-typ…
Questions that mention Ingot (8)
- What is the most appropriate order of steps for making wafers from a single-crystal ingot?
- Which equipment is commonly used to slice a silicon ingot into many wafers at once?
- Which conditions are mainly adjusted during pulling to keep the diameter of a silicon single-crystal ingot constant?
- When finishing a CZ pull, why is the ingot diameter gradually reduced (a tail cone is formed) before separating it from the melt?
- Which impurity is typically added to the melt to make p-type silicon crystals by the CZ method?
- When a doped crystal is pulled by the CZ method, the dopant concentration tends to be higher toward the bottom of the crystal (later in the pull). Why?
- What is the cylindrical block of single-crystal silicon grown by the CZ method or similar, before it is cut into wafers, called?
- What is the main reason silicon wafers are round?
Related terms
Czochralski (CZ) method Segregation coefficient Slurry Dicing Spin coating CMP Crystal orientation DZ (denuded zone) FZ method (float zone) Gettering