What is Pad conditioning?
Abrading the surface of a CMP polishing pad with a diamond tool to restore its texture and slurry-holding ability, stabilizing the removal rate. Also called dressing.
Field: CMP and cleaning
Pad conditioning in the explanations
Prevention includes slurry filtration, circulation and temperature control, pad conditioning and optimized polish pressure.
What is the main cause of fine scratches on the wafer surfa…
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Related terms
CMP Slurry Ceria (cerium oxide) Dilute hydrofluoric acid (DHF) Dishing Erosion Megasonic cleaning Native oxide Pattern collapse Preston's equation