Silicon wafers

Which equipment is commonly used to slice a silicon ingot into many wafers at once?

  1. ADicing blade
  2. BMulti-wire saw
  3. CCMP tool
Show answer and explanation

Answer: B. Multi-wire saw

A multi-wire saw runs many thin parallel wires carrying abrasive or diamond, cutting the ingot into many wafers at once. The kerf is small, reducing wasted material. A dicing blade is used to cut finished wafers into chips.

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More Silicon wafers questions

  1. What is the main purpose of chamfering (beveling) the edge of a wafer?
  2. Which impurity is typically added to the melt to make p-type silicon crystals by the CZ method?
  3. When a doped crystal is pulled by the CZ method, the dopant concentration tends to be higher toward the bottom of the crystal (later in the pull). Why?
  4. Which correctly describes 450 mm wafers, developed as the next diameter after 300 mm?
  5. What is the purpose of using bulk microdefects (BMDs), formed by oxygen precipitation inside CZ wafers?