What is Dual damascene?
Forming both the trench for a wire and the hole for a via in the insulator, filling them with copper together and finishing with a single CMP step. It reduces process steps.
Field: Interconnect processes
Dual damascene in the explanations
Filling trenches and vias together is called dual damascene.
Which correctly describes the damascene process commonly us…Dual damascene fills trenches and vias with copper together.
Which correctly describes a via in multilevel interconnects?Dual damascene patterns both via holes and wiring trenches into the dielectric, then fills them together with barrier, seed and electroplated copper and finishes with a single CMP.
What is the method called that fills wiring trenches and vi…
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Related terms
CMP Damascene process Yield Air gap Backside power delivery Barrier metal Black's equation Crosstalk Interconnect via IR drop