What is Damascene process?
A method of forming interconnects by etching trenches in an insulating film, filling them with metal, and removing the excess metal by CMP. Used for copper wiring.
Field: Interconnect processes
Damascene process in the explanations
In the damascene process, a barrier (e.g., Ta/TaN) and a Cu seed layer a few to tens of nm thick are sputtered into the trenches, and copper is then electroplated to fill them.
Which deposition method is mainly used to fill trenches for…
Questions that mention Damascene process (2)
Related terms
CMP Dual damascene Seed layer Air gap Backside power delivery Barrier metal Black's equation Crosstalk Interconnect via IR drop