An analysis method that shines X-rays at a grazing angle so they totally reflect, then sensitively measures the fluorescent X-rays from trace metal contamination on the wafer surface.
Field: Metrology and analysis
Analyzing the collected liquid by ICP-MS or total-reflection X-ray fluorescence (TXRF) measures whole-wafer metal contamination with sensitivity around 10⁸–10⁹ atoms/cm².
To analyze metal contamination on a wafer surface with high…TXRF directs X-rays at the wafer surface at a very shallow angle so they are totally reflected, and measures the fluorescent X-rays from atoms near the surface.
Which method is often used to analyze trace metal contamina…Native oxide ICP (inductively coupled plasma) AFM (atomic force microscope) CD-SEM Defect inspection system EDX (energy-dispersive X-ray spectroscopy) Ellipsometry FIB (focused ion beam) Four-point probe method SEM (scanning electron microscope)