Metrology and analysis

Which method is often used to analyze trace metal contamination on wafer surfaces?

  1. ATotal reflection X-ray fluorescence (TXRF)
  2. BFour-point probe method
  3. CEllipsometry
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Answer: A. Total reflection X-ray fluorescence (TXRF)

TXRF directs X-rays at the wafer surface at a very shallow angle so they are totally reflected, and measures the fluorescent X-rays from atoms near the surface. Because it analyzes only the surface with high sensitivity, it is used to control trace metal contamination on wafer surfaces, for example in evaluating cleaning steps.

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