What is Silicon interposer?

A silicon intermediate substrate that holds chips side by side and connects them densely with fine wiring. It is used to connect GPUs and HBM, among other things.

Field: Advanced packaging (3D and chiplets)

Silicon interposer in the explanations

Questions that mention Silicon interposer (8)

  1. Which correctly describes the role of the silicon interposer used in 2.5D packaging?
  2. Which approach, instead of a large silicon interposer, embeds small pieces of silicon only at the chip-to-chip connection areas to achieve high-density wiring?
  3. In AI GPUs, what is the main reason the GPU chip and HBM are placed side by side on one silicon interposer?
  4. Which TSMC 2.5D packaging technology is widely used to place AI GPUs and HBM side by side on a silicon interposer and connect them?
  5. In 2.5D packaging, what is the main advantage of using an interposer made of redistribution layers (RDL) of organic dielectric and copper wiring instead of a silicon interposer?
  6. Which correctly describes HBM (High Bandwidth Memory)?
  7. Which correctly describes the difference between 2.5D and 3D packaging?
  8. Through the HBM3 generation, which is the data bus width per HBM stack?

Related terms

2.5D packaging HBM GPU CoWoS Redistribution layer (RDL) 3D packaging Hybrid bonding Chiplet Microbump TSV (through-silicon via)

Back to the glossary