Advanced packaging (3D and chiplets)

Which correctly describes the role of the silicon interposer used in 2.5D packaging?

  1. AA heat sink for cooling chips
  2. BAn intermediate substrate on which several chips are placed side by side and connected at high density with fine wiring
  3. CA photomask used for exposure
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Answer: B. An intermediate substrate on which several chips are placed side by side and connected at high density with fine wiring

A silicon interposer is an intermediate silicon substrate with fine wiring made by semiconductor processes. Several chips, such as a processor and HBM, are placed side by side on it and connected with high-density wiring impossible on ordinary package substrates. The interposer connects to the package substrate through TSVs.

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More Advanced packaging (3D and chiplets) questions

  1. Which correctly describes hybrid bonding?
  2. Which correctly describes a feature of fan-out wafer-level packaging (FOWLP)?
  3. Which industry-standard die-to-die interface aims to let chiplets from different companies connect to each other?
  4. Which is especially likely to be a challenge in 3D packaging, which stacks chips vertically?
  5. Which correctly describes SiP (system in package)?