Advanced packaging (3D and chiplets)

Which approach, instead of a large silicon interposer, embeds small pieces of silicon only at the chip-to-chip connection areas to achieve high-density wiring?

  1. AWire bonding approach
  2. BSilicon bridge approach
  3. CLead frame approach
Show answer and explanation

Answer: B. Silicon bridge approach

In the silicon bridge approach, small pieces of silicon covering only the connection areas between adjacent chips are embedded in the package substrate, and fine wiring on them connects the chips at high density. Because no large interposer is needed, large-area packaging becomes possible while keeping costs down.

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More Advanced packaging (3D and chiplets) questions

  1. Which is a correct advantage of glass substrates, being considered in place of organic materials for next-generation large package substrates?
  2. What is the technology called that mounts optical transceiver components close to switch ICs and the like in the same package, shortening electrical wiring to reduce power?
  3. Among hybrid bonding methods, which allows only chips judged good in test to be selected and bonded to the target wafer?
  4. What are the bumps called, far smaller than ordinary solder balls, used to connect chips stacked with TSVs and to connect chips to interposers?
  5. In AI GPUs, what is the main reason the GPU chip and HBM are placed side by side on one silicon interposer?