Advanced packaging (3D and chiplets)

Which correctly describes HBM (High Bandwidth Memory)?

  1. AA slow memory using a single layer of flash memory
  2. BAn SRAM cache built into the CPU chip
  3. CA memory that stacks several DRAM dies with TSVs and achieves high bandwidth with a very wide bus
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Answer: C. A memory that stacks several DRAM dies with TSVs and achieves high bandwidth with a very wide bus

HBM stacks several DRAM dies with TSVs and connects them to the processor through a very wide data bus of more than 1,000 lines, achieving high data transfer bandwidth. It is used in 2.5D packaging, placed beside the processor on a silicon interposer or similar, and is mounted on AI GPUs and other devices.

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More Advanced packaging (3D and chiplets) questions

  1. Which correctly describes the role of the silicon interposer used in 2.5D packaging?
  2. Which correctly describes hybrid bonding?
  3. Which correctly describes a feature of fan-out wafer-level packaging (FOWLP)?
  4. Which industry-standard die-to-die interface aims to let chiplets from different companies connect to each other?
  5. Which is especially likely to be a challenge in 3D packaging, which stacks chips vertically?