What is CoWoS?

TSMC's 2.5D packaging technology, which places logic chips and HBM side by side on a silicon interposer. It is widely used for AI GPUs and similar products.

Field: Advanced packaging (3D and chiplets)

CoWoS in the explanations

CoWoS (Chip on Wafer on Substrate) is a 2.5D packaging technology that mounts chips on a wafer-form interposer (chip on wafer) and then mounts that on a package substrate (on substrate).
Which TSMC 2.5D packaging technology is widely used to plac…

Questions that mention CoWoS (1)

Which TSMC 2.5D packaging technology is widely used to place AI GPUs and HBM side by side on a silicon interposer and connect them?

Related terms

2.5D packaging HBM Silicon interposer 3D packaging Chiplet Hybrid bonding Microbump Redistribution layer (RDL) TSV (through-silicon via) UCIe

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