What is Redistribution layer (RDL)?
A wiring layer formed on a chip or wafer surface to route pads out to the positions of the external terminals. It is used in fan-out packages and interposers.
Redistribution layer (RDL) in the explanations
Organic RDL interposers do not use silicon wafer processing, so they keep cost down more easily, and they are flexible and easier to make large.
In 2.5D packaging, what is the main advantage of using an i…A redistribution layer (RDL) routes wiring from the chip's bond pads to where external terminals such as solder balls are to be placed.
What is the wiring layer called that is formed on a chip or…
Questions that mention Redistribution layer (RDL) (2)
- In 2.5D packaging, what is the main advantage of using an interposer made of redistribution layers (RDL) of organic dielectric and copper wiring instead of a silicon interposer?
- What is the wiring layer called that is formed on a chip or wafer surface to route electrode positions to the positions of external terminals?
Related terms
2.5D packaging Silicon interposer 3D packaging Chiplet CoWoS HBM Hybrid bonding Microbump TSV (through-silicon via) UCIe