Deposition (CVD and PVD)

Which deposition method is mainly used to fill trenches for copper wiring?

  1. AThermal oxidation
  2. BElectroplating
  3. CIon implantation
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Answer: B. Electroplating

In the damascene process, a barrier layer and a thin copper seed layer are sputtered into the trenches, and copper is then filled by electroplating. Additives in the plating bath make copper grow preferentially from the bottom of the trench, allowing void-free filling.

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More Deposition (CVD and PVD) questions

  1. Which is a characteristic of low-pressure CVD (LPCVD)?
  2. Which source gas is commonly used to deposit polysilicon by LPCVD?
  3. Which correctly describes vacuum evaporation?
  4. What problem tends to occur when a deposited thin film has large internal stress?
  5. What is the method called in which liquid material is dropped onto the center of a wafer and spun at high speed to form a uniform film?