Packaging and assembly

What is the step called that attaches and fixes the chip at a set position on a lead frame or substrate?

  1. AWire bonding
  2. BDicing
  3. CDie bonding
Show answer and explanation

Answer: C. Die bonding

Die bonding fixes the singulated chip (die) to a lead frame or substrate with an adhesive such as silver paste, solder or die-attach film. Wire bonding then electrically connects the chip to the external terminals.

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More Packaging and assembly questions

  1. What is the step called that grinds the back side of a wafer before dicing to thin it and make the package thinner?
  2. What is the phenomenon called in which, when a moisture-laden resin package is heated in solder reflow, the moisture inside suddenly vaporizes and expands, cracking the package?
  3. In wire bonding, what is the main reason gold (Au) wire has been increasingly replaced by copper (Cu) wire?
  4. Which symbol denotes the thermal resistance from the chip junction to the surrounding air, indicating a package's heat-dissipation performance?
  5. Which method prints solder paste on a printed circuit board, places components and then heats the board in an oven to solder them?