Packaging and assembly

Which correctly describes dicing?

  1. AThe step of encapsulating chips in resin
  2. BThe step of testing the electrical characteristics of chips
  3. CThe step of cutting a wafer into individual chips
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Answer: C. The step of cutting a wafer into individual chips

Dicing is the step in which a wafer with finished circuits is cut with a diamond blade or laser and separated into individual chips (dies). The cut chips proceed to die bonding, wire bonding, encapsulation and other steps.

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More Packaging and assembly questions

  1. Which material is mainly used as the encapsulant in typical resin-molded packages?
  2. Which materials are commonly used for lead frames?
  3. Which correctly describes a CSP (chip-scale package)?
  4. Which correctly describes a feature of wafer-level packaging (WLP)?
  5. In flip-chip mounting, what is the main purpose of filling the gap between chip and substrate with underfill resin?