What is Die bonding?
Attaching and fixing a diced chip at its position on a lead frame or package substrate, using adhesive, solder or sintered material.
Field: Packaging and assembly
Die bonding in the explanations
The cut chips proceed to die bonding, wire bonding, encapsulation and other steps.
Which correctly describes dicing?Die bonding fixes the singulated chip (die) to a lead frame or substrate with an adhesive such as silver paste, solder or die-attach film.
What is the step called that attaches and fixes the chip at…
Questions that mention Die bonding (2)
Related terms
Wire bonding Dicing Lead frame Backgrinding BGA CSP (chip-scale package) Flip chip Reflow soldering Thermal resistance Underfill