What is Wafer test (probe test)?
Checking the electrical characteristics of each chip on the wafer by touching probes to its pads before dicing. It finds bad chips before assembly so they are not packaged needlessly.
Field: Testing and inspection
Wafer test (probe test) in the explanations
In wafer test, the needles of a probe card touch the chip's bond pads, and a tester checks electrical characteristics and functions.
Which correctly describes wafer test (probe test)?Defective chips used to be marked with ink, but now wafer test results are typically saved as electronic wafer map data, and the die bonder in assembly reads that data to pick only good chips.
Which method is now common for passing information on chips…Addresses of faulty locations found at wafer test are recorded in laser-cut fuses or electrically programmed antifuses, and accesses are redirected to spares; post-package repair (PPR) allows fixes even after packaging.
Which correctly describes redundancy repair, used to improv…
Questions that mention Wafer test (probe test) (11)
- Which correctly describes wafer test (probe test)?
- Which method is now common for passing information on chips judged defective in wafer test to the later assembly process?
- In wafer test, what is it called to push the probe needles slightly further after they touch the bond pads to ensure contact?
- What is the technique called that dynamically changes test items or limits per chip or per lot based on intermediate results and statistics, such as from wafer test?
- What is the main purpose of analyzing wafer maps, which show wafer test results as pass/fail for each chip position on the wafer?
- If wafer process yield is 95% and wafer test yield is 90%, approximately what is the overall yield obtained by multiplying them?
- Which correctly describes redundancy repair, used to improve DRAM yield?
- Which correctly describes a probe card?
- In final test after packaging, which machine works with the tester to feed ICs automatically and sort them according to test results?
- Which correctly describes the typical test flow of semiconductor products?
- Which correctly describes ATE (automatic test equipment)?
Related terms
Probe card Yield Redundancy repair Burn-in ATE (automatic test equipment) ATPG (automatic test pattern generation) BIST (built-in self-test) DFT (design for testability) Fault coverage IDDQ test