Which dicing method, with almost no kerf loss, focuses a laser inside the wafer to create a modified layer and then separates chips by stretching the tape?

Answer: A. Stealth dicing

Stealth dicing focuses a laser at a wavelength that passes through silicon inside the wafer to create a modified layer, and the wafer is broken from there by stretching the tape. It produces no debris and almost no kerf, suiting thin wafers, MEMS and other chips that must avoid contamination and mechanical damage.

• A. Correct. A modified layer is formed inside and the wafer is broken along it.
• B. Blade dicing cuts with a rotating blade, leaving kerf and debris.
• C. A wire saw slices ingots into wafers.