Packaging and assembly

What is the step called that grinds the back side of a wafer before dicing to thin it and make the package thinner?

  1. ABack grinding
  2. BCMP
  3. CEtch-back
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Answer: A. Back grinding

In back grinding, the front of the wafer is protected with tape while the back is ground with a grinding wheel to the specified thickness. For memory packages with stacked chips, wafers may be thinned to a few tens of µm. The damaged layer from grinding is removed by polishing or etching.

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