What is SC-2 (HPM)?
A mixture of hydrochloric acid, hydrogen peroxide and water used after SC-1 in RCA cleaning to remove metal contamination.
Field: CMP and cleaning
SC-2 (HPM) in the explanations
The RCA clean, published by Kern and colleagues at RCA in 1970, first removes particles and organics with alkaline SC-1, then removes metals—which SC-1 tends to leave behind—as chlorides with acidic SC-2 (HCl:H2O2:H2O).
Which correctly describes the order and purposes of SC-1 an…SC-2 removes metal contamination, and dilute HF removes native oxide.
What is the main purpose of SC-1 (a mixture of ammonia and …SC-1 removes organics and particles, and SC-2 removes metals.
What is the main purpose of cleaning with dilute hydrofluor…
Questions that mention SC-2 (HPM) (4)
- Which correctly describes the order and purposes of SC-1 and SC-2 in standard RCA cleaning?
- What is the main purpose of SC-1 (a mixture of ammonia and hydrogen peroxide) in RCA cleaning?
- What is the main purpose of cleaning with dilute hydrofluoric acid (DHF)?
- Which set correctly lists the kinds of surface contamination removed from wafers by cleaning?
Related terms
SC-1 (APM) Native oxide RCA clean Dilute hydrofluoric acid (DHF) Silicide SPM (sulfuric acid-hydrogen peroxide mixture) Ceria (cerium oxide) CMP Dishing Erosion