CMP and cleaning

Which correctly describes the order and purposes of SC-1 and SC-2 in standard RCA cleaning?

  1. ASC-1 removes particles and organics, then SC-2 removes metal contamination
  2. BSC-2 removes particles, then SC-1 removes metal contamination
  3. CSC-1 and SC-2 are mixed and used together
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Answer: A. SC-1 removes particles and organics, then SC-2 removes metal contamination

The basic RCA sequence is alkaline SC-1 first to remove particles and organics, then acidic SC-2 to remove metal contamination. A dilute HF step to remove oxide is inserted between them as needed, and wafers are rinsed with deionized water between steps.

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More CMP and cleaning questions

  1. What is the main cause of pattern collapse when cleaning and drying high-aspect-ratio patterns?
  2. Why are oxidizers such as hydrogen peroxide added to the slurry in tungsten CMP?
  3. What is a correct design countermeasure to the CMP removal amount varying with pattern density within a chip?
  4. What is the approximate size of the abrasive particles in CMP slurries?
  5. What is the main purpose of diluting chemicals or using functional water in recent cleaning processes?