CMP and cleaning

What is the main purpose of cleaning with dilute hydrofluoric acid (DHF)?

  1. ARemoving organics
  2. BDepositing metal films
  3. CRemoving native oxide
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Answer: C. Removing native oxide

Hydrofluoric acid dissolves SiO2, so cleaning with dilute HF removes the thin native oxide on silicon. Afterward, the silicon surface is hydrogen-terminated and hydrophobic. SC-1 is used to remove organics and particles, and SC-2 to remove metal contamination.

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More CMP and cleaning questions

  1. Which correctly describes the slurry used in CMP?
  2. What is the main purpose of cleaning with a mixture of sulfuric acid and hydrogen peroxide (SPM)?
  3. What in particular must be removed by cleaning after CMP?
  4. What is an advantage of single-wafer cleaning tools, which process one wafer at a time?
  5. What is the main purpose of using IPA (isopropyl alcohol) when drying wafers after cleaning?