What is SC-1 (APM)?
A mixture of ammonia, hydrogen peroxide and water used first in RCA cleaning. It removes particles and organics while lightly etching the surface.
Field: CMP and cleaning
SC-1 (APM) in the explanations
SC-1 (NH4OH:H2O2:H2O, e.g., 1:1:5 at about 70 °C) oxidizes the surface with peroxide while ammonia slowly dissolves that oxide at roughly 0.1–1 nm per minute, undercutting and lifting particles away.
What is the main purpose of SC-1 (a mixture of ammonia and …This is one reason SC-1 removes particles so effectively.
Why are particles, once detached, unlikely to redeposit in …The RCA clean, published by Kern and colleagues at RCA in 1970, first removes particles and organics with alkaline SC-1, then removes metals—which SC-1 tends to leave behind—as chlorides with acidic SC-2 (HCl:H2O2:H2O).
Which correctly describes the order and purposes of SC-1 an…
Questions that mention SC-1 (APM) (7)
- What is the main purpose of SC-1 (a mixture of ammonia and hydrogen peroxide) in RCA cleaning?
- Why are particles, once detached, unlikely to redeposit in alkaline cleaning solutions such as SC-1?
- Which correctly describes the order and purposes of SC-1 and SC-2 in standard RCA cleaning?
- In SC-1 (a mixture of ammonia and hydrogen peroxide), what role does the hydrogen peroxide play?
- What is the main purpose of cleaning with dilute hydrofluoric acid (DHF)?
- Which cleaning method applies MHz-range ultrasound to the cleaning solution to remove tiny particles from the wafer surface?
- Which set correctly lists the kinds of surface contamination removed from wafers by cleaning?
Related terms
SC-2 (HPM) Native oxide RCA clean Dilute hydrofluoric acid (DHF) Silicide Megasonic cleaning SPM (sulfuric acid-hydrogen peroxide mixture) Ceria (cerium oxide) CMP Dishing