What is Erosion?
In CMP, excessive polishing of an entire region of dense lines, insulator included, so it ends up lower than its surroundings. Along with dishing of wide lines, it is a typical CMP defect.
Field: CMP and cleaning
Erosion in the explanations
Erosion concentrates where the field is strongest, carving a groove, so magnets are rotated to improve target utilization.
What is the main purpose of placing magnets behind the targ…Etching 500 nm of oxide consumes 100 nm of mask, so allowing for overetch and edge erosion the mask should be at least about 150–200 nm thick.
If the oxide etch rate is 100 nm/min and the mask is consum…Plasma erosion of chamber walls releases metal contamination such as aluminum and particles, and changing wall conditions shift the process.
Why are coatings such as yttrium oxide (Y2O3) used on the i…
Questions that mention Erosion (4)
- What is the main purpose of placing magnets behind the target in magnetron sputtering?
- If the oxide etch rate is 100 nm/min and the mask is consumed at 20 nm/min, what is the selectivity to the mask?
- Why are coatings such as yttrium oxide (Y2O3) used on the inner walls and parts of plasma etch tools?
- Which correctly describes 'dishing' in CMP?
Related terms
Plasma Magnetron sputtering Selectivity Overetch Hard mask Dishing CMP Ceria (cerium oxide) Dilute hydrofluoric acid (DHF) Megasonic cleaning