What is Bosch process (deep RIE)?
A dry-etching technique that alternates short etch and sidewall-passivation steps to cut deep, vertical holes and trenches in silicon. It is used for MEMS and TSVs.
Field: MEMS and sensors
Bosch process (deep RIE) in the explanations
The Bosch process alternates every few seconds between SF6-plasma silicon etching and C4F8 passivation deposition.
Which correctly describes deep RIE (the Bosch process) used…Bulk micromachining instead etches deep into the substrate itself, often from the back side, with anisotropic KOH etching or deep RIE, to form membranes such as pressure-sensor diaphragms and through-holes.
Which MEMS fabrication method builds movable structures by …A TSV is made by etching a hole in silicon by deep etching (such as the Bosch process), forming an insulating film, barrier layer and seed layer on the inside of the hole, then filling it with copper or similar by plating.
Which correctly describes the typical TSV formation process?
Questions that mention Bosch process (deep RIE) (3)
Related terms
MEMS TSV (through-silicon via) Plasma Seed layer Accelerometer Anodic bonding Capacitive sensing Coriolis force Gyroscope Hall-effect sensor