Advanced packaging (3D and chiplets)

Which correctly describes the typical TSV formation process?

  1. AConnect by threading wires through
  2. BForm it simply by pouring in solder
  3. CEtch a hole by deep etching, form an insulating film and barrier layer, then fill with copper or similar
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Answer: C. Etch a hole by deep etching, form an insulating film and barrier layer, then fill with copper or similar

A TSV is made by etching a hole in silicon by deep etching (such as the Bosch process), forming an insulating film, barrier layer and seed layer on the inside of the hole, then filling it with copper or similar by plating. The wafer is then thinned from the back to expose the TSV tips.

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More Advanced packaging (3D and chiplets) questions

  1. What is the main aim of manufacturing packages all at once on large rectangular panels instead of round wafers?
  2. To stack chips with TSVs, approximately how thin are wafers ground from the back?
  3. Which correctly describes the benefits expected from using chiplets?
  4. Which correctly describes the conditions required of the surfaces to be joined in hybrid bonding?
  5. Which correctly describes the role of the base die (logic die) at the bottom of an HBM stack?