Testing and inspection

What is the purpose of enabling a prober's wafer stage (chuck) to be controlled to high or low temperature?

  1. ATo dry the wafer
  2. BTo confirm at the wafer stage whether chips meet specifications across the actual operating temperature range
  3. CTo bond the chips
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Answer: B. To confirm at the wafer stage whether chips meet specifications across the actual operating temperature range

Chip characteristics change with temperature: leakage rises at high temperature, and timing shifts at low temperature. Controlling the chuck temperature and testing wafers hot and cold finds temperature-dependent failures before packaging, reducing wasted assembly cost.

  • A. It is not for drying.
  • B. Correct. It confirms performance over the operating temperature range at the wafer stage.
  • C. It is not for bonding.
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More Testing and inspection questions

  1. In logic testing, which pair correctly names the test that exhaustively detects structural faults (such as stuck-at faults) using scan and similar, and the test that checks function as in actual operation?
  2. What is it called when good chips are judged defective and discarded because test limits are too strict or measurements are unstable?
  3. In memory testing, what is the main purpose of making a map recording which bits at which addresses failed?
  4. When compressing scan test outputs, why must signals whose value (0 or 1) is undetermined in simulation (unknowns, X) be removed?
  5. In testing high-speed serial interfaces, which method loops the chip's transmitter output back to its receiver so the chip itself verifies communication?