Testing and inspection

Which method is now common for passing information on chips judged defective in wafer test to the later assembly process?

  1. ADefective chips are left unmarked and all chips are retested in assembly
  2. BIt is passed to assembly as an electronic wafer map
  3. COperators memorize it visually
Show answer and explanation

Answer: B. It is passed to assembly as an electronic wafer map

Defective chips used to be marked with ink, but now wafer test results are typically saved as electronic wafer map data, and the die bonder in assembly reads that data to pick only good chips.

Practice this topic Back to topic

More Testing and inspection questions

  1. For automotive semiconductors, what is the main reason for testing not only at room temperature but also at high and low temperatures?
  2. In memory testing, which test pattern repeats writing and reading 0s and 1s while stepping through addresses in order, detecting defects such as interference between adjacent cells?
  3. Which correctly describes ATE (automatic test equipment)?
  4. In wafer test, what is it called to push the probe needles slightly further after they touch the bond pads to ensure contact?
  5. Which pair correctly names the two properties that design for testability aims to improve?