DRAM

Which correctly describes redundancy repair, used to improve DRAM yield?

  1. ARows or columns containing defective cells are replaced with spare rows or columns prepared in advance
  2. BAll chips containing defective cells are discarded
  3. CThe supply voltage is raised to make defective cells work
Show answer and explanation

Answer: A. Rows or columns containing defective cells are replaced with spare rows or columns prepared in advance

In large-capacity memory such as DRAM, discarding a whole chip because of a few defective cells would greatly reduce yield. Spare rows and columns are therefore provided, and defective locations found in testing are switched to spares using fuses or similar means.

Practice this topic Back to topic

More DRAM questions

  1. What does an error-correcting code (ECC) used in memory do?
  2. In DRAM, why is access time shorter when the same row (page) is accessed repeatedly?
  3. Why are high-k materials such as zirconium oxide used for the dielectric film of DRAM capacitors?
  4. Which correctly describes the self-refresh mode of DRAM?
  5. How much is an 8 Gbit DRAM chip in bytes?