Testing and inspection

Which correctly describes the typical test flow of semiconductor products?

  1. AFinal test → wafer test → assembly → shipment
  2. BAssembly → wafer test → shipment → final test
  3. CWafer test → assembly → final test → shipment
Show answer and explanation

Answer: C. Wafer test → assembly → final test → shipment

First, wafer test is performed on wafers that have completed front-end processing, identifying defective chips. Only good chips are packaged in assembly, and their characteristics are checked in final test before shipment. For some products, burn-in is performed before or after final test.

Practice this topic Back to topic

More Testing and inspection questions

  1. Which items are mainly checked in an AC test?
  2. What is the technology called that expands test patterns inside the chip and compresses the responses to reduce scan test data volume and test time?
  3. What is the test called that runs at the actual operating frequency to detect defects where signals propagate too slowly?
  4. What is it called to classify products by performance, such as operating speed and power consumption, based on test results?
  5. In testing, what is it called to set pass/fail limits slightly tighter than the product specification to allow for measurement error and drift over time?