Testing and inspection

Which correctly describes wafer test (probe test)?

  1. ABefore dicing, probes contact each chip on the wafer to test its electrical characteristics
  2. BAfter package encapsulation, only the appearance is inspected
  3. CProducts are used for a long period to determine their failure rate
Show answer and explanation

Answer: A. Before dicing, probes contact each chip on the wafer to test its electrical characteristics

In wafer test, the needles of a probe card touch the chip's bond pads, and a tester checks electrical characteristics and functions. Finding defective chips at this stage keeps them out of the packaging process, reducing cost.

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More Testing and inspection questions

  1. Which correctly describes the purpose of burn-in?
  2. Which correctly describes scan design, a form of design for testability (DFT)?
  3. Which items are mainly checked in a semiconductor DC test?
  4. Which correctly describes BIST (built-in self-test)?
  5. Which correctly describes a probe card?