Silicon wafers

What is the cylindrical block of single-crystal silicon grown by the CZ method or similar, before it is cut into wafers, called?

  1. ATarget
  2. BIngot
  3. CPellet
Show answer and explanation

Answer: B. Ingot

The cylindrical block obtained by single-crystal pulling is called an ingot. After its outer surface is ground to a uniform diameter, it is sliced thinly into wafers.

  • A. A target is a plate of source material used in sputtering.
  • B. Correct. A cylindrical single-crystal block is an ingot.
  • C. A pellet is material formed into small granules.
Practice this topic Back to topic

More Silicon wafers questions

  1. What is the main reason silicon wafers are round?
  2. Which pair of Japanese companies holds a large share of the global silicon wafer market?
  3. In the CZ method, what is the purpose of growing a thin neck just after the seed crystal at the start of pulling (necking)?
  4. What causes "slip", a problem when large-diameter wafers are heat-treated at high temperature?
  5. Which is closest to the mass of one silicon wafer 300 mm in diameter and 775 µm thick? (Silicon density is about 2.33 g/cm³.)