Silicon wafers

Which conditions are mainly adjusted during pulling to keep the diameter of a silicon single-crystal ingot constant?

  1. AThe pull rate and melt temperature
  2. BThe color of the ingot
  3. CThe brightness of the fab lighting
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Answer: A. The pull rate and melt temperature

In the CZ method, the region where the crystal meets the melt is monitored with cameras, and the pull rate and heater power (melt temperature) are adjusted to keep the diameter constant. The pull rate affects not only the diameter but also the defects incorporated into the crystal.

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More Silicon wafers questions

  1. Which is one reason SiC wafers are difficult and expensive to manufacture?
  2. Roughly what size in inches is a silicon wafer 300 mm in diameter commonly called?
  3. What is the cylindrical block of single-crystal silicon grown by the CZ method or similar, before it is cut into wafers, called?
  4. What is the main reason silicon wafers are round?
  5. Which pair of Japanese companies holds a large share of the global silicon wafer market?