Silicon wafers

What is the most appropriate order of steps for making wafers from a single-crystal ingot?

  1. ASlicing → lapping (grinding) → etching → mirror polishing
  2. BMirror polishing → slicing → etching → lapping
  3. CEtching → mirror polishing → slicing → lapping
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Answer: A. Slicing → lapping (grinding) → etching → mirror polishing

The ingot is cut into thin slices with a wire saw or similar (slicing), and lapping or grinding sets thickness and flatness. Next, the damaged layer from machining is removed by etching, and finally mirror polishing gives a mirror-like surface. The wafers are then cleaned and inspected before shipment.

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More Silicon wafers questions

  1. Which correctly describes a typical method of manufacturing SOI wafers?
  2. Which crystal orientation is commonly used for silicon wafers for CMOS LSIs?
  3. Which correctly describes the relationship between the resistivity of a silicon wafer and its doping concentration?
  4. Which is closest to the standard thickness of a 300 mm silicon wafer?
  5. In the CZ method, what is the main purpose of controlling the ratio of pull rate to temperature gradient in the crystal (V/G)?