Interconnect processes

What is the method called that fills wiring trenches and vias with copper at the same time and finishes them with a single CMP step?

  1. ASingle damascene process
  2. BEtch-back process
  3. CDual damascene process
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Answer: C. Dual damascene process

In the dual damascene process, both via holes and wiring trenches are formed in the insulator, then filled together with a barrier layer, a seed layer and copper plating, and finished with one CMP step. It needs fewer steps than single damascene, which forms vias and wiring separately, and eliminates the interface between via and wire.

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More Interconnect processes questions

  1. What is the role of the thin copper film sputtered before filling copper by electroplating?
  2. What problems occur when copper filling is incomplete and a void remains in a via?
  3. If the spacing between adjacent wires in the same layer is halved, approximately how does the capacitance between them change? (Approximate as parallel plates.)
  4. Which technique forms vias self-aligned to wiring trenches to tolerate misalignment between upper and lower wiring layers?
  5. For wiring with a resistivity of 2 µΩ·cm, 1 mm long, with width and thickness of 100 nm each, approximately what is the resistance?