Advanced packaging (3D and chiplets)
Which correctly describes a TSV (through-silicon via)?
- ALateral wiring formed only on the chip surface
- BAn electrode that passes through the silicon substrate in the thickness direction, connecting stacked chips vertically
- CA solder ball used as an external package terminal
Show answer and explanation
Answer: B. An electrode that passes through the silicon substrate in the thickness direction, connecting stacked chips vertically
A TSV (Through-Silicon Via) is an electrode made by drilling a hole in the silicon substrate and filling it with conductor, electrically connecting the front and back of the substrate. It allows chips to be stacked with many connections over shorter distances than wire bonding, so it is used in 3D packaging and HBM.